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Thickness of a tinning of a wire is controlled by a micrometer in the course of a tinning without stopping of the movement of a wire. Resistance of an obluzheny wire has to be less than 16 ohms/m, current on the conductor – no more than 5 And. A period of storage of a tinned wire before assembly no more than 15 days. In certain cases for increase in a period of storage the wire after a tinning becomes covered by anticorrosive gumboil of FPP.

The tests which are carried out by a number of the enterprises showed the increased reliability of solder connections of the micromodules assembled on a method of the selective soldering in comparison with solder connections of the micromodules assembled by other methods.

Before filling put on special polyamide nozzles with rubber laying micromodules the making-out face parties of the micromodule and preventing hit of a compound on conclusions. Nozzles are also greased with GKZh-94 liquid or the SKT liquid rubber.

mix is vacuumized and cooled up to the temperature of 35-40C. After cooling the demanded quantity of a polietilenpoliamin is entered into mix and mix is vacuumized in a vacuum case within 5-7 min. at a temperature of 40 Pages again.

Existence in all grooves of microcells of the dosed amount of not oxidized solder, use of the svezheluzhenny not oxidized conductors and strict observance of the modes of the soldering. Especially the importance has a choice of a way of heating and temperature condition. Heating, on the one hand, has to be sufficient to melt solder both in microcell grooves, and on the conductor, and on the other hand, temperature of heating and its duration should not specify to an overheat of microcells above 70-80 C in order to avoid irreversible change of their electric parameters.

Controlers have to perform all operations of entrance control in rubber or cotton fingerstalls of a voizbezhaniya of pollution and "zasalivaniye" of printing conductors and the metallized grooves of micropayments.

This operation does not cause essential technological difficulties, however it must be kept in mind that the method of cutting and a design of the tool have to be chosen so that when cutting the located places of the soldering and thereof there was no violation of solder connections of conductors with microcells were not loaded with a row.

Check of micromodules is made on lack of deformation and break of conclusions, absence of scratches and chips, absence on face surfaces, the alien impregnations, hollows and other defects worsening moisture-proofness and appearance of the micromodule.

The standard micropayment is intended for crossing points, printing and volume resistance of condensers and diodes. On a special micropayment heavy and volume elements fasten: transistors in the metal case, transformers, inductance coils, etc.

From installation of filling of a form are automatically transferred to installation of polymerization of a compound. After an exit from installation of polymerization of a form are cooled with flowing water, understand, and from the products taken from them ingates are removed.

Control of microcells on compliance to specifications in electric parameters is exercised in the special adaptation providing simultaneous engagement with all twelve grooves of a micropayment. The adaptation is connected to the corresponding instrumentations and stands.

It was experimentally defined that for receiving reliable solder connection solder layer thickness on the connecting conductor has to make 15-20 microns, and height of filling of a groove with solder on a micropayment of 3-5 mm.

Special collections or combs are typed from plates of various thickness according to the card of assembly, thickness of a micropayment and height of a microcell. At a turn round excentricly located axis on 180 degrees of a plate form grooves for installation of microcells and micropayments. As operation of a set of such comb labor-consuming, it is expedient to have a set of combs under each type of the micromodule.

The micromodule of etazherochny type represents a set of microcells and crossing points on the standard micropayments collected in the form of the whatnot and connected among themselves by conductors according to an electric circuit.